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Fuji Die Co., Ltd.will exhibit at INTERMOLD 2018 . ○ Date : April 18 (Wed.) - April 21 (Sat.), 2018 ○ Opening hours : 10:00 - 17:00(Last day 16:00) ○ Venue : INTEX OSAKA ○ Booth No. :6B-703 ○ Featured Product: The world's smallest WC grain size of the alloy "TJS01" ⇒ WC average particle size of 0.1μm base of high-strength binderless cemented carbide (Primary use) high-pressure vessel (artificial diamond synthesis), lens mold, etc. ※ Please contact us for other applications. ○ Exhibits: ・ Cold & Hot Milling Rolls / Forming Rolls ・ Forging Dies ・ Molds for Batteries ・ Anvils (Extra High Pressure) ・ Copper Tungsten Electrodes for EDM ・ Grinding Wheels ◆Official site: https://www.intermold.jp/english/top/ ※Please see the details about product summary on the products list page.