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2016/04/11information
INTERMOLD 2016

Fuji Die Co., Ltd.will exhibit at INTERMOLD 2016 .

○ Date : April 20 (Wed.) - April 23 (Sat.), 2016  
○ Opening hours : 10:00 - 17:00
○ Venue : INTEX OSAKA
○ Booth No. : 6B-912
○ Featured Product : The world's smallest WC grain size of the alloy "TJS01"
⇒ WC average particle size of 0.1μm base of high-strength binderless cemented carbide（Primary use） high-pressure vessel (artificial diamond synthesis), lens mold, etc.※ Please contact us for other applications.
○ Exhibits:
・Cold & Hot Milling Rolls / Forming Rolls　
・ Forging Dies
・ Molds for Batteries
・Anvils (Extra High Pressure)
・ Copper Tungsten Electrodes for EDM
・ Grinding Wheels

◆Official site:http://intermold.jp/english/
※Please see the details about product summary on the products list page.

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