2019/04/01

Fuji Die Co., Ltd.will exhibit at INTERMOLD 2019 .

○ Date　　　　　　　　　: April 17 (Wed.) - April 20 (Sat.), 2019
○ Opening hours　　　　 : 10:00 - 17:00(Last day 16:00)
○ Venue　　　　　　　　 : TOKYO BIG SIGHT
○ Booth No.　　　　　　 ：
○ Featured Product: The world's smallest WC grain size of the alloy "TJS01"
⇒ WC average particle size of 0.1μm base of high-strength binderless cemented carbide
（Primary use） high-pressure vessel (artificial diamond synthesis), lens mold, etc.
※ Please contact us for other applications.

○ Exhibits:
　　・ Cold & Hot Milling Rolls / Forming Rolls　
　　・ Forging Dies
　　・ Molds for Batteries
　　・ Anvils (Extra High Pressure)
　　・ Copper Tungsten Electrodes for EDM
　　・ Grinding Wheels

◆Official site: Click here
※Please see the details about product summary on the products list page.